Shuttle DH610 XPC slim Barebone Système - PC Compact Socket LGA-1700 Chipset Intel H610 Certifié Energy Star Ethernet 25 Gigabit
Shuttle DH610 XPC slim Barebone Système - PC Compact Sock...
Shuttle DH610 XPC slim Barebone Système - PC Compact Socket LGA-1700 Chipset Intel H610 Certifié Energy Star Ethernet 25 Gigabit
Shuttle DH610
Nouveau marque
Disponibilité:
En stock.
, prêt à être expédié
.
- Free Shipping
- 1 an Garantie
- Retours de 30 jours.
- Neutre en carbone
Caractéristiques clés du produit
- Design PC mince avec un facteur de forme compact
- Prend en charge le Socket LGA-1700 pour une large gamme de processeurs, y compris Core i9, Celeron, Pentium Gold, Core i3, Core i5 et Core i7
- Technologie de mémoire SDRAM DDR4 avec prise en charge jusqu'à 64 Go de mémoire
- Chipset H610 fabriqué par Intel pour des performances fiables
- Certifié Energy Star pour l'efficacité énergétique
- Guide de l'utilisateur multilingue inclus pour une configuration facile
- Compatibilité avec le support VESA pour des options d'installation flexibles
- Port USB de type C pour un transfert de données rapide
- Port HDMI pour se connecter à des écrans externes
- Prend en charge les systèmes d'exploitation Windows 11 x64, Linux et Windows 10 x64
£352.00
Livraison express GRATUITE
Retours gratuits.
Livraison GRATUITE
heures
minutes
Informations d'expédition
Demandez à nos experts
Appelez-nous maintenant.
888.267.9566
Shuttle
DH610
Return Policy |
Time to Return |
|
Standard Return Policy |
We offer a hassle-free 30-day returns policy for domestic (US) orders, excluding non-refundable items. Refund or Replacement within 30 days of the delivery date. All products that fall under the Standard Return Policy qualify for our 30-Day Hassle-Free Returns. Please see the section above for more details. |
|
Replacement Only Return Policy |
Replacement within 30 days of the delivery date. |
|
Manufacturer Only Return Policy |
Covered by the manufacturer's warranty. Please refer to the terms and conditions for the manufacturer's warranty or contact the manufacturer. |
|
Holiday Extended Return Policies |
Extended Holiday Return Policy.Qualifying purchases of products displaying the " Extended Holiday Return Policy ", from November 1st, 2023 to December 25, 2023, are eligible for a Refund or Replacement until January 31, 2024. Extended Holiday Replacement-Only Return PolicyQualifying purchases of products displaying the " Extended Holiday Replacement-Only Return Policy ", from November 1st, 2023 to December 25, 2023, are eligible for a Replacement until January 31, 2024. |
Compact Power in a Sleek Design
The Shuttle DH610's refined profile exemplifies efficient space utilization without compromising on connectivity. The front panel provides easy access to essential ports including USB Type-C and audio connections, while the robust metal chassis ensures reliable operation in demanding environments. The thoughtful design maintains optimal airflow for sustained performance.
Technical Specifications
- Space-efficient 1.3L chassis design
- Front-accessible USB 3.2 Gen 1 Type-C port
- Integrated audio ports for versatile connectivity
Applications
- Digital signage deployment in retail environments
- Space-constrained office workstations
- Industrial control systems
Industrial-Grade Durability
Built for continuous operation, the DH610's rugged construction features a precision-engineered ventilation system. The sleek black exterior houses enterprise-grade components designed to withstand 24/7 operation in temperatures up to 50°C. Each detail serves both form and function, from the thermal-optimized chassis to the strategically placed I/O ports.
Technical Specifications
- Operating temperature range up to 50°C
- Optimized ventilation system
- Durable metal chassis construction
Applications
- Healthcare facility computing systems
- Manufacturing environment deployments
- Point-of-sale terminal integration
Intuitive Front Panel Interface
The streamlined front panel design prioritizes accessibility with clearly marked controls and status indicators. LED indicators provide instant system status feedback, while the power button and I/O ports are positioned for convenient access. This user-centric design ensures smooth operation in both attended and unattended installations.
Technical Specifications
- Clear LED status indicators
- Accessible power controls
- Strategic port placement
Applications
- Self-service kiosk systems
- Interactive digital displays
- Automated service terminals
Enhanced Connectivity Hub
The rear I/O panel delivers comprehensive connectivity options with dual display outputs, dual Ethernet ports, and multiple USB connections. The inclusion of COM ports supports legacy industrial equipment, while modern DisplayPort and HDMI outputs enable multi-display configurations. This versatile I/O selection ensures compatibility with diverse peripheral requirements.
Technical Specifications
- Dual DisplayPort and HDMI outputs
- Dual Ethernet with 2.5G support
- Multiple USB 3.2 ports
Applications
- Multi-display digital signage
- Network-intensive applications
- Industrial automation systems
Advanced Thermal Management
The internal layout reveals sophisticated cooling engineering with dual fans and optimized airflow paths. The removable cover provides easy access for maintenance while maintaining structural integrity. This thermal design ensures reliable operation even under heavy processing loads, making it ideal for demanding applications.
Technical Specifications
- Dual-fan cooling system
- Tool-less maintenance access
- Optimized internal airflow design
Applications
- High-performance computing tasks
- Extended operation environments
- Climate-controlled installations
Enterprise-Grade Architecture
The motherboard layout showcases industrial-grade components and the LGA 1700 socket supporting 12th Gen Intel processors. The efficient component placement maximizes the compact form factor while ensuring upgrade potential. Premium capacitors and power delivery components ensure system stability and longevity.
Technical Specifications
- LGA 1700 socket support
- Industrial-grade components
- Optimized PCB layout
Applications
- Mission-critical applications
- Long-term deployment scenarios
- Performance-intensive workloads
Questions fréquemment posées
The Shuttle DH610 XPC slim supports Intel's 12th generation Core processors (Alder Lake-S) through its LGA-1700 socket. Compatible processors include Intel Core i9, Core i7, Core i5, Core i3, Pentium Gold, and Celeron processors. The system can accommodate one processor and is designed to work with the Intel H610 chipset.
