英特尔 金牌 5317 十二核心 3 GHz 处理器 18 MB L3 缓存 插座 LGA-4189 10 纳米 第三代

英特尔 金牌 5317 十二核心 3 GHz 处理器 18 MB L3 缓存 插座 LGA-4189 10 纳米 第三代
英特尔 金牌 5317 十二核心 3 GHz 处理器 18 MB L3 缓存 插座 LGA-4189 10 纳米 第三代
英特尔 金牌 5317 十二核心 3 GHz 处理器 18 MB L3 缓存 插座 LGA-4189 10 纳米 第三代

英特尔 金牌 5317 十二核心 3 GHz 处理器 18 MB L3 缓存 插座 LGA-4189 10 纳米 第三代

Intel CD8068904657302

$10,128.00
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产品关键特征

  • Intel Xeon Gold (3rd Gen) 5317 十二核心 3 GHz 处理器
  • 18 MB L3 缓存以提高数据访问速度
  • LGA-4189 插座，方便安装
  • 64 位处理以提升性能
  • 可超频至 3.60 GHz 用于处理要求高的任务
  • 10 纳米工艺技术以提高效率
  • 150 W 热设计功率以获得最佳冷却效果
  • 处理器线程：24，用于多任务处理
  • OEM 包装，提供经济实惠的解决方案
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Intel

CD8068904657302

Intel Xeon Gold 5317 12-Core Server Processor - 3GHz, Socket LGA-4189, 3rd Gen

Experience exceptional server performance with the Intel Xeon Gold 5317, a powerful 12-core processor designed for demanding data center and multi-cloud computing environments. This 3rd generation processor, built on advanced 10nm technology, delivers base speeds of 3.0 GHz with turbo boost capability up to 3.60 GHz, making it ideal for intensive enterprise workloads.

Advanced Processing Architecture

  • Dodeca-core (12 Core) architecture with 24 threads for superior multitasking
  • 18 MB L3 Cache for enhanced data access and processing
  • Socket LGA-4189 compatibility for enterprise-grade systems
  • 10nm process technology for improved efficiency
  • 64-bit processing capability for advanced computing needs

Performance and Thermal Specifications

The Xeon Gold 5317 operates at a base clock speed of 3.0 GHz and can reach up to 3.60 GHz with overclocking capabilities. With a Thermal Design Power (TDP) of 150W and maximum thermal specification of 84°C (183.2°F), this processor delivers reliable performance while maintaining optimal thermal efficiency.

Enterprise-Grade Features

Designed for professional server environments, this OEM processor supports enhanced memory capacity and four-socket scalability. The Intel Xeon Gold 5317 is optimized for mainstream data center operations, multi-cloud compute environments, and demanding network and storage workloads.

Technical Specifications

Specification Detail
Processor Model Xeon Gold 5317
Core Configuration 12 Cores / 24 Threads
Base/Turbo Frequency 3.0 GHz / 3.60 GHz
Cache Size 18 MB L3
Socket Type LGA-4189
Manufacturing Process 10 nm
TDP 150W
英特尔®至强®金处理器

支持更高的内存速度，增强的内存容量和四插槽可伸缩性，英特尔®至强®金处理器在性能，高级可靠性和硬件增强安全性方面带来了显著改进。 它针对要求严格的主流数据中心，多云计算以及网络和存储工作负载进行了优化。 具有高达四插槽可伸缩性，适用于更广泛的工作负载。

Return Policy

Time to Return

Standard Return Policy

We offer a hassle-free 30-day returns policy for domestic (US) orders, excluding non-refundable items. Refund or Replacement within 30 days of the delivery date. All products that fall under the Standard Return Policy qualify for our 30-Day Hassle-Free Returns. Please see the section above for more details.

Replacement Only Return Policy

Replacement within 30 days of the delivery date.

Manufacturer Only Return Policy

Covered by the manufacturer's warranty. Please refer to the terms and conditions for the manufacturer's warranty or contact the manufacturer.

Holiday Extended Return Policies

Extended Holiday Return Policy.

Qualifying purchases of products displaying the " Extended Holiday Return Policy ", from November 1st, 2023 to December 25, 2023, are eligible for a Refund or Replacement until January 31, 2024.

Extended Holiday Replacement-Only Return Policy

Qualifying purchases of products displaying the " Extended Holiday Replacement-Only Return Policy ", from November 1st, 2023 to December 25, 2023, are eligible for a Replacement until January 31, 2024.

常见问题
The Intel Xeon Gold 5317 is a high-performance 3rd Gen processor featuring 12 cores (24 threads) with a base clock speed of 3.0 GHz and can reach up to 3.60 GHz when overclocked. It's built on a 10 nm process technology and includes 18 MB of L3 cache. The processor uses the Socket LGA-4189 interface and supports 64-bit processing.
The Intel Xeon Gold 5317 has a Thermal Design Power (TDP) of 150W and can operate at temperatures up to 84°C (183.2°F). This thermal specification ensures reliable performance in demanding server environments while maintaining efficient power consumption.
The Intel Xeon Gold 5317 is optimized for demanding mainstream data center operations, multi-cloud compute environments, and network and storage workloads. It offers enhanced reliability and hardware-enhanced security features, making it ideal for enterprise-level applications that require robust performance and scalability.
The Intel Xeon Gold 5317 supports up to four-socket scalability, allowing for significant system expansion. This scalability feature makes it suitable for an expanded range of workloads and enables businesses to build powerful multi-processor systems for demanding enterprise applications.
The Intel Xeon Gold 5317 supports higher memory speeds and enhanced memory capacity compared to previous generations. As part of the Xeon Gold series, it's designed to handle intensive memory operations, making it ideal for memory-demanding applications in data center environments.
The Intel Xeon Gold 5317 processor has physical dimensions of 3.1 inches in width and 2.2 inches in depth. These dimensions are compatible with the LGA-4189 socket form factor, ensuring proper fit in server motherboards designed for this platform.
The 10nm process technology used in the Xeon Gold 5317 enables improved power efficiency and better performance per watt. This advanced manufacturing process allows for higher transistor density, resulting in better overall performance while maintaining the 150W TDP envelope.
The Intel Xeon Gold 5317 features 12 physical cores with 24 threads through Intel's Hyper-Threading Technology. This multi-threading capability enables efficient parallel processing and improved performance for multi-threaded applications and server workloads.

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