This item: Module de mémoire DDR3 SDRAM AddOn AM1866D3QR4LRN/32G 32 ...
$85.49
Total price: $85.49
Description
Spécifications techniques
Politique de remboursement
AddOn
AM1866D3QR4LRN/32G
Return Policy
Time to Return
Standard Return Policy
We offer a hassle-free 30-day returns policy for domestic (US) orders, excluding non-refundable items. Refund or Replacement within 30 days of the delivery date. All products that fall under the Standard Return
Policy
qualify for our 30-Day Hassle-Free Returns. Please see the section above for more details.
Replacement Only Return Policy
Replacement within 30 days of the delivery date.
Manufacturer Only Return Policy
Covered by the manufacturer's warranty.
Please refer to the terms and conditions for the manufacturer's warranty or contact the manufacturer.
Holiday Extended Return Policies
Extended Holiday Return Policy.
Qualifying purchases of products displaying the " Extended Holiday
Return Policy ",
from November 1st, 2023 to December 25, 2023, are eligible for a Refund or Replacement until January 31,
2024.
Extended Holiday Replacement-Only Return Policy
Qualifying purchases of products displaying the " Extended Holiday
Replacement-Only Return Policy ",
from November 1st, 2023 to December 25, 2023, are eligible for a Replacement until January 31, 2024.
Enterprise-Grade DDR3 Memory with Advanced Heat Dissipation
The 32GB DDR3 SDRAM module features a robust thermal design with precision-engineered heat spreaders that ensure optimal temperature management during intensive server operations. The silver-colored aluminum heat shields provide maximum surface area for effective heat dissipation while protecting the underlying memory chips.
Technical Specifications
240-pin LRDIMM form factor for enterprise servers
1866 MHz speed with CL13 timing for rapid data access
Integrated thermal protection system with aluminum heat spreaders
Applications
High-performance database management systems
Virtualization environments requiring large memory pools
Mission-critical enterprise applications
High-Density Server Memory with Precision Engineering
This LRDIMM module exemplifies enterprise-class memory design with its carefully arranged components and premium build quality. The load-reduced architecture allows for higher memory densities while maintaining system stability and performance in demanding server environments.
Technical Specifications
Load-reduced architecture for enhanced signal integrity
32GB capacity for maximum memory density
JEDEC-compliant design for guaranteed compatibility
Applications
Large-scale data processing operations
Cloud computing infrastructure
High-performance computing clusters
Server-Grade Memory with Enhanced Reliability Features
The module's advanced PCB design and component layout optimize signal integrity and power delivery. Each memory chip is protected by dedicated thermal solutions, ensuring consistent performance even under heavy workloads in data center environments.
Technical Specifications
Enterprise-grade PCB with optimized trace routing
Multi-layer thermal management system
Error correction capability for data integrity
Applications
24/7 enterprise server operations
Data center memory upgrades
High-availability systems
Maximum Memory Density with Thermal Excellence
This 32GB module demonstrates superior thermal management through its comprehensive heat spreader design. The precision-mounted thermal solution ensures optimal heat distribution across the entire module, maintaining peak performance during intensive computational tasks.
Technical Specifications
Uniform heat distribution system
1.5V operating voltage for power efficiency
Premium-grade memory chips with thermal protection
Applications
Enterprise resource planning systems
Large-scale virtualization deployments
High-performance computing applications
High-Performance Memory with Advanced Cooling Design
The angled perspective reveals the sophisticated thermal management system integrated into every module. The carefully engineered heat spreaders work in conjunction with server cooling systems to maintain optimal operating temperatures under heavy workloads.
Technical Specifications
Advanced thermal dissipation design
Server-optimized memory architecture
High-reliability component selection
Applications
Data-intensive server applications
Enterprise virtualization platforms
High-performance computing environments
Enterprise Memory with Superior Signal Integrity
The front view highlights the module's premium build quality and attention to detail in component placement. The gold-plated contacts ensure reliable connections, while the robust PCB design supports consistent performance in mission-critical applications.
Technical Specifications
Gold-plated contacts for superior connectivity
Optimized PCB layout for signal integrity
Enterprise-grade component quality
Applications
Critical database servers
Enterprise cloud infrastructure
High-availability computing systems
Data Center-Ready Memory with Thermal Protection
This perspective emphasizes the module's robust construction and thermal management capabilities. The specialized heat spreader design ensures reliable operation in dense server environments where thermal management is crucial.
Technical Specifications
Server-optimized thermal design
High-density memory architecture
Enterprise reliability features
Applications
Data center server deployments
High-performance computing clusters
Enterprise virtualization hosts
Precision-Engineered Memory for Enterprise Servers
The detailed view showcases the module's premium construction and attention to thermal management. Each component is precisely placed to optimize airflow and heat dissipation in demanding server environments.
Technical Specifications
Optimized component placement
Enhanced thermal management
Server-grade reliability features
Applications
Mission-critical server applications
Enterprise data processing
High-performance computing workloads
Questions fréquemment posées
The AddOn AM1866D3QR4LRN/32G is a 32GB DDR3 SDRAM memory module operating at 1866 MHz with a voltage of 1.50V. It features CL13 latency timing and uses LRDIMM form factor with 240-pin configuration. This high-performance RAM is specifically designed for workstations and servers.
This memory module is compatible with several specific systems including: UCS B200 M3 Blade Server, UCS B-Series B420 M3 Blade Server, UCS C240 M3 Rack-Mount Server, and Dell Precision Workstation T7610. It's built to JEDEC Standards and guaranteed to meet or exceed Tier 1 OEM factory requirements.
The AddOn memory module comes with a Lifetime Limited Warranty. Additionally, the product is protected under the MAGNUSON-MOSS WARRANTY ACT, which guarantees that installation won't affect or void OEM warranties, providing users with complete peace of mind.
This RAM is optimized for workstations and servers with its 32GB capacity, 1866 MHz speed, and LRDIMM (Load-Reduced DIMM) form factor. The CL13 latency and 1.50V operating voltage ensure reliable performance in demanding enterprise environments. Its specifications are specifically designed to handle intensive server and workstation workloads.
This memory module uses an LRDIMM (Load-Reduced DIMM) form factor and features a 240-pin configuration. These specifications are standard for enterprise-grade memory modules and ensure compatibility with supported server and workstation systems.
The memory module is built to JEDEC Standards and is guaranteed to meet or exceed Tier 1 OEM's factory requirements. It's 100% guaranteed to be compatible with its intended systems, and AddOn ensures the product will work right the first time. The module maintains strict adherence to industry standards for maximum reliability and compatibility.
This memory module operates at 1866 MHz speed with a voltage requirement of 1.50V. It also features CL13 (CAS Latency 13) timing, which provides an excellent balance of performance and reliability for server and workstation applications.
Yes, this memory module is manufactured in the United States. AddOn ensures high-quality standards and reliability through domestic manufacturing, providing customers with enterprise-grade memory solutions that meet strict quality control requirements.