Module de mémoire DDR3 SDRAM AddOn AM1866D3QR4LRN/32G 32 Go RAM haute performance pour stations de travail et serveurs

Side view of 32GB DDR3 SDRAM memory module with silver heat spreaders and gold contact pins-alternate-image1
Horizontal view of DDR3 SDRAM module showing memory architecture and heat spreader design-alternate-image2
Angled view of DDR3 RAM module highlighting thermal protection and circuit design-alternate-image3
Close-up view of DDR3 memory module heat spreader and component layout-alternate-image4
Angled perspective of DDR3 SDRAM module showing integrated cooling system-alternate-image5
Front view of DDR3 memory module showing gold contacts and heat spreader arrangement-alternate-image6
Perspective view of DDR3 RAM module showing thermal protection features-alternate-image7
Detailed view of DDR3 SDRAM module highlighting precision engineering-alternate-image8
Side view of 32GB DDR3 SDRAM memory module with silver heat spreaders and gold contact pins-alternate-image1
Horizontal view of DDR3 SDRAM module showing memory architecture and heat spreader design-alternate-image2
Angled view of DDR3 RAM module highlighting thermal protection and circuit design-alternate-image3
Close-up view of DDR3 memory module heat spreader and component layout-alternate-image4
Angled perspective of DDR3 SDRAM module showing integrated cooling system-alternate-image5
Front view of DDR3 memory module showing gold contacts and heat spreader arrangement-alternate-image6
Perspective view of DDR3 RAM module showing thermal protection features-alternate-image7
Detailed view of DDR3 SDRAM module highlighting precision engineering-alternate-image8
Side view of 32GB DDR3 SDRAM memory module with silver heat spreaders and gold contact pins-alternate-image1
Horizontal view of DDR3 SDRAM module showing memory architecture and heat spreader design-alternate-image2
Angled view of DDR3 RAM module highlighting thermal protection and circuit design-alternate-image3
Close-up view of DDR3 memory module heat spreader and component layout-alternate-image4
Angled perspective of DDR3 SDRAM module showing integrated cooling system-alternate-image5
Front view of DDR3 memory module showing gold contacts and heat spreader arrangement-alternate-image6
Perspective view of DDR3 RAM module showing thermal protection features-alternate-image7
Detailed view of DDR3 SDRAM module highlighting precision engineering-alternate-image8
Module de mémoire DDR3 SDRAM AddOn AM1866D3QR4LRN/32G 32 ...
Side view of 32GB DDR3 SDRAM memory module with silver heat spreaders and gold contact pins-alternate-image1
Horizontal view of DDR3 SDRAM module showing memory architecture and heat spreader design-alternate-image2
Angled view of DDR3 RAM module highlighting thermal protection and circuit design-alternate-image3
Close-up view of DDR3 memory module heat spreader and component layout-alternate-image4
Angled perspective of DDR3 SDRAM module showing integrated cooling system-alternate-image5
Front view of DDR3 memory module showing gold contacts and heat spreader arrangement-alternate-image6
Perspective view of DDR3 RAM module showing thermal protection features-alternate-image7
Detailed view of DDR3 SDRAM module highlighting precision engineering-alternate-image8

Module de mémoire DDR3 SDRAM AddOn AM1866D3QR4LRN/32G 32 Go RAM haute performance pour stations de travail et serveurs

AddOn AM1866D3QR4LRN/32G

RM418.00 MYR RM648.00 MYR Save RM230 MYR
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  • Retours de 30 jours.
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Caractéristiques clés du produit

  • Module de mémoire SDRAM DDR3 de 32 Go
  • Garantie à vie limitée
  • Compatible avec UCS B200 M3 Blade Server, UCS B-Series B420 M3 Blade Server, UCS C240 M3 Rack-Mount Server, Workstation Precision T7610
  • Fabriqué aux États-Unis
  • Latence CAS : CL13
  • Taille de la mémoire : 32 Go
  • Vitesse de la mémoire : 1866 MHz
  • Tension de la mémoire : 1,50 V
  • Appareils pris en charge : Workstation, Server
  • Technologie de la mémoire : SDRAM DDR3
  • Facteur de forme : LRDIMM
  • Nombre de broches : 240 broches
RM418.00 MYR
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AM1866D3QR4LRN/32G

Return Policy

Time to Return

Standard Return Policy

We offer a hassle-free 30-day returns policy for domestic (US) orders, excluding non-refundable items. Refund or Replacement within 30 days of the delivery date. All products that fall under the Standard Return Policy qualify for our 30-Day Hassle-Free Returns. Please see the section above for more details.

Replacement Only Return Policy

Replacement within 30 days of the delivery date.

Manufacturer Only Return Policy

Covered by the manufacturer's warranty. Please refer to the terms and conditions for the manufacturer's warranty or contact the manufacturer.

Holiday Extended Return Policies

Extended Holiday Return Policy.

Qualifying purchases of products displaying the " Extended Holiday Return Policy ", from November 1st, 2023 to December 25, 2023, are eligible for a Refund or Replacement until January 31, 2024.

Extended Holiday Replacement-Only Return Policy

Qualifying purchases of products displaying the " Extended Holiday Replacement-Only Return Policy ", from November 1st, 2023 to December 25, 2023, are eligible for a Replacement until January 31, 2024.

Side view of 32GB DDR3 SDRAM memory module with silver heat spreaders and gold contact pins

Enterprise-Grade DDR3 Memory with Advanced Heat Dissipation

The 32GB DDR3 SDRAM module features a robust thermal design with precision-engineered heat spreaders that ensure optimal temperature management during intensive server operations. The silver-colored aluminum heat shields provide maximum surface area for effective heat dissipation while protecting the underlying memory chips.

Technical Specifications

  • 240-pin LRDIMM form factor for enterprise servers
  • 1866 MHz speed with CL13 timing for rapid data access
  • Integrated thermal protection system with aluminum heat spreaders

Applications

  • High-performance database management systems
  • Virtualization environments requiring large memory pools
  • Mission-critical enterprise applications
Horizontal view of DDR3 SDRAM module showing memory architecture and heat spreader design

High-Density Server Memory with Precision Engineering

This LRDIMM module exemplifies enterprise-class memory design with its carefully arranged components and premium build quality. The load-reduced architecture allows for higher memory densities while maintaining system stability and performance in demanding server environments.

Technical Specifications

  • Load-reduced architecture for enhanced signal integrity
  • 32GB capacity for maximum memory density
  • JEDEC-compliant design for guaranteed compatibility

Applications

  • Large-scale data processing operations
  • Cloud computing infrastructure
  • High-performance computing clusters
Angled view of DDR3 RAM module highlighting thermal protection and circuit design

Server-Grade Memory with Enhanced Reliability Features

The module's advanced PCB design and component layout optimize signal integrity and power delivery. Each memory chip is protected by dedicated thermal solutions, ensuring consistent performance even under heavy workloads in data center environments.

Technical Specifications

  • Enterprise-grade PCB with optimized trace routing
  • Multi-layer thermal management system
  • Error correction capability for data integrity

Applications

  • 24/7 enterprise server operations
  • Data center memory upgrades
  • High-availability systems
Close-up view of DDR3 memory module heat spreader and component layout

Maximum Memory Density with Thermal Excellence

This 32GB module demonstrates superior thermal management through its comprehensive heat spreader design. The precision-mounted thermal solution ensures optimal heat distribution across the entire module, maintaining peak performance during intensive computational tasks.

Technical Specifications

  • Uniform heat distribution system
  • 1.5V operating voltage for power efficiency
  • Premium-grade memory chips with thermal protection

Applications

  • Enterprise resource planning systems
  • Large-scale virtualization deployments
  • High-performance computing applications
Angled perspective of DDR3 SDRAM module showing integrated cooling system

High-Performance Memory with Advanced Cooling Design

The angled perspective reveals the sophisticated thermal management system integrated into every module. The carefully engineered heat spreaders work in conjunction with server cooling systems to maintain optimal operating temperatures under heavy workloads.

Technical Specifications

  • Advanced thermal dissipation design
  • Server-optimized memory architecture
  • High-reliability component selection

Applications

  • Data-intensive server applications
  • Enterprise virtualization platforms
  • High-performance computing environments
Front view of DDR3 memory module showing gold contacts and heat spreader arrangement

Enterprise Memory with Superior Signal Integrity

The front view highlights the module's premium build quality and attention to detail in component placement. The gold-plated contacts ensure reliable connections, while the robust PCB design supports consistent performance in mission-critical applications.

Technical Specifications

  • Gold-plated contacts for superior connectivity
  • Optimized PCB layout for signal integrity
  • Enterprise-grade component quality

Applications

  • Critical database servers
  • Enterprise cloud infrastructure
  • High-availability computing systems
Perspective view of DDR3 RAM module showing thermal protection features

Data Center-Ready Memory with Thermal Protection

This perspective emphasizes the module's robust construction and thermal management capabilities. The specialized heat spreader design ensures reliable operation in dense server environments where thermal management is crucial.

Technical Specifications

  • Server-optimized thermal design
  • High-density memory architecture
  • Enterprise reliability features

Applications

  • Data center server deployments
  • High-performance computing clusters
  • Enterprise virtualization hosts
Detailed view of DDR3 SDRAM module highlighting precision engineering

Precision-Engineered Memory for Enterprise Servers

The detailed view showcases the module's premium construction and attention to thermal management. Each component is precisely placed to optimize airflow and heat dissipation in demanding server environments.

Technical Specifications

  • Optimized component placement
  • Enhanced thermal management
  • Server-grade reliability features

Applications

  • Mission-critical server applications
  • Enterprise data processing
  • High-performance computing workloads
Questions fréquemment posées
The AddOn AM1866D3QR4LRN/32G is a 32GB DDR3 SDRAM memory module operating at 1866 MHz with a voltage of 1.50V. It features CL13 latency timing and uses LRDIMM form factor with 240-pin configuration. This high-performance RAM is specifically designed for workstations and servers.
This memory module is compatible with several specific systems including: UCS B200 M3 Blade Server, UCS B-Series B420 M3 Blade Server, UCS C240 M3 Rack-Mount Server, and Dell Precision Workstation T7610. It's built to JEDEC Standards and guaranteed to meet or exceed Tier 1 OEM factory requirements.
The AddOn memory module comes with a Lifetime Limited Warranty. Additionally, the product is protected under the MAGNUSON-MOSS WARRANTY ACT, which guarantees that installation won't affect or void OEM warranties, providing users with complete peace of mind.
This RAM is optimized for workstations and servers with its 32GB capacity, 1866 MHz speed, and LRDIMM (Load-Reduced DIMM) form factor. The CL13 latency and 1.50V operating voltage ensure reliable performance in demanding enterprise environments. Its specifications are specifically designed to handle intensive server and workstation workloads.
This memory module uses an LRDIMM (Load-Reduced DIMM) form factor and features a 240-pin configuration. These specifications are standard for enterprise-grade memory modules and ensure compatibility with supported server and workstation systems.
The memory module is built to JEDEC Standards and is guaranteed to meet or exceed Tier 1 OEM's factory requirements. It's 100% guaranteed to be compatible with its intended systems, and AddOn ensures the product will work right the first time. The module maintains strict adherence to industry standards for maximum reliability and compatibility.
This memory module operates at 1866 MHz speed with a voltage requirement of 1.50V. It also features CL13 (CAS Latency 13) timing, which provides an excellent balance of performance and reliability for server and workstation applications.
Yes, this memory module is manufactured in the United States. AddOn ensures high-quality standards and reliability through domestic manufacturing, providing customers with enterprise-grade memory solutions that meet strict quality control requirements.

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