AddOn B4U39AA-AA Module de mémoire SDRAM DDR3 4 Go 1600 MHz RAM non tamponnée

Side view of AddOn 4GB DDR3 SDRAM memory module showing green PCB and black memory chips-alternate-image1
Horizontal view of AddOn RAM module highlighting memory chips and circuit layout-alternate-image2
Angled perspective of DDR3 RAM module showing thermal-optimized component layout-alternate-image3
Close-up view of DDR3 memory module showing detailed chip placement and circuitry-alternate-image4
Perspective view of RAM module highlighting engineering quality and construction-alternate-image5
Horizontal profile of DDR3 SODIMM module showing compact design-alternate-image6
Angled view of DDR3 RAM module emphasizing professional build quality-alternate-image7
Close-up detail of RAM module circuit architecture and component layout-alternate-image8

AddOn B4U39AA-AA Module de mémoire SDRAM DDR3 4 Go 1600 MHz RAM non tamponnée

AddOn B4U39AA-AA

€34,95
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Disponibilité: En stock. , prêt à être expédié .
  • Free Shipping
  • 1 an Garantie
  • Retours de 30 jours.
  • Neutre en carbone

Caractéristiques clés du produit

  • Module de mémoire DDR3 SDRAM de 4 Go
  • Garantie à vie limitée
  • Compatible avec HP B4U39AA
  • Traitement de signal non tamponné
  • Vitesse de mémoire de 1600 MHz
  • Tension de mémoire de 1,35V
  • Standard de mémoire DDR3-1600/PC3-12800
  • Facteur de forme SoDIMM de 204 broches
  • Double rangée
  • Fabriqué en Chine
€34,95
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  • Description

AddOn

B4U39AA-AA

AddOn B4U39AA-AA 4GB DDR3-1600MHz SODIMM Memory Module

Enhance your system's performance with the AddOn B4U39AA-AA 4GB DDR3 SDRAM Memory Module. This HP-compatible 204-pin SODIMM operates at 1600MHz with a low voltage requirement of 1.35V, making it an efficient choice for upgrading your system's memory capacity.

Advanced Memory Specifications

  • DDR3-1600/PC3-12800 memory standard for optimal performance
  • 4GB capacity with Dual Rank configuration
  • Unbuffered design with CL11 latency
  • 204-pin SODIMM form factor
  • Energy-efficient 1.35V operation

Compatibility and Reliability

Built to strict JEDEC standards, this memory module meets or exceeds Tier 1 OEM factory requirements. The B4U39AA-AA is 100% compatible with HP systems and comes with a lifetime warranty, ensuring long-term reliability and peace of mind.

Physical Specifications

  • SoDIMM form factor with 500 mil thickness
  • 2-inch width for standard compatibility
  • Approximate weight: 8 ounces
  • Single module configuration (1 x 4GB)

Warranty and Support

This AddOn memory module comes with a lifetime limited warranty and is guaranteed not to affect or void OEM warranties, as protected by federal law. Experience reliable performance and professional support throughout the product's lifetime.

Cette mémoire HP B4U39AA compatible de 4 Go DDR3-1600MHz à rang double non tamponnée 1,35V 204 broches CL11 SODIMM est garantie à 100% compatible avec votre système et fonctionnera correctement dès la première utilisation. Ajouter de la mémoire supplémentaire est le meilleur moyen d'augmenter les performances de votre système. Toute notre mémoire est construite selon des normes JEDEC strictes pour répondre ou dépasser les exigences d'usine des OEM de niveau 1. Nos produits sont également garantis par la loi fédérale de ne pas affecter ou annuler les garanties des OEM.

Side view of AddOn 4GB DDR3 SDRAM memory module showing green PCB and black memory chips

Lightning-Fast 1600MHz Performance for Enhanced Computing

The AddOn DDR3 SDRAM module delivers exceptional speed and reliability with its 1600MHz frequency and 1.35V power efficiency. This 4GB memory stick features unbuffered operation and CL11 latency for responsive data handling.

Technical Specifications

  • 1600MHz speed for rapid data access
  • 1.35V low-voltage operation
  • CL11 latency optimization

Applications

  • Server memory upgrades
  • Workstation performance enhancement
  • Enterprise computing systems
Horizontal view of AddOn RAM module highlighting memory chips and circuit layout

Precision-Engineered Memory Architecture

Experience superior build quality with this DDR3 SODIMM module featuring premium components and meticulous engineering. The dual-rank design optimizes data throughput while maintaining stable performance.

Technical Specifications

  • Dual-rank architecture
  • Gold-plated contacts
  • Premium-grade PCB construction

Applications

  • Data center deployments
  • High-performance computing
  • Mission-critical systems
Angled perspective of DDR3 RAM module showing thermal-optimized component layout

Advanced Thermal Management Design

Built with optimal component spacing and thermal considerations, this module ensures stable operation under heavy workloads. The strategic layout of memory chips and circuitry promotes effective heat dissipation.

Technical Specifications

  • Optimized thermal design
  • Strategic chip placement
  • Enhanced cooling efficiency

Applications

  • Intensive computing operations
  • Extended runtime environments
  • High-temperature conditions
Close-up view of DDR3 memory module showing detailed chip placement and circuitry

Enterprise-Grade Component Integration

Each memory chip is precisely positioned and integrated into the high-quality PCB, ensuring optimal signal integrity and performance. The module features carefully selected components that meet strict quality standards.

Technical Specifications

  • Precision component placement
  • High-grade memory chips
  • Optimized signal routing

Applications

  • Enterprise servers
  • Professional workstations
  • Performance-critical applications
Perspective view of RAM module highlighting engineering quality and construction

Robust Engineering for Lasting Performance

The module's architecture emphasizes durability and reliability with its robust PCB design and carefully engineered component layout. Each element is positioned for optimal performance and longevity.

Technical Specifications

  • Industrial-grade PCB material
  • Reinforced construction
  • Reliability-focused design

Applications

  • Long-term deployment
  • 24/7 operation environments
  • Critical system applications
Horizontal profile of DDR3 SODIMM module showing compact design

Streamlined Form Factor Excellence

The 204-pin SODIMM design delivers maximum compatibility while maintaining a compact profile. Every aspect of the module is engineered for consistent performance and reliable operation.

Technical Specifications

  • 204-pin configuration
  • Space-efficient design
  • Universal compatibility

Applications

  • Space-constrained systems
  • Compact server solutions
  • High-density computing
Angled view of DDR3 RAM module emphasizing professional build quality

Professional-Grade Memory Solution

This module represents the pinnacle of DDR3 memory technology, featuring advanced engineering and premium components. The design emphasizes both performance and reliability for demanding enterprise environments.

Technical Specifications

  • Enterprise-class components
  • Advanced memory architecture
  • Performance-optimized design

Applications

  • Professional computing
  • Enterprise solutions
  • High-reliability systems
Close-up detail of RAM module circuit architecture and component layout

Precision Circuit Architecture

The detailed circuit layout showcases the module's sophisticated design, with each component carefully positioned for optimal signal integrity and performance. The high-density design maximizes functionality while maintaining reliability.

Technical Specifications

  • High-density circuit design
  • Optimized signal paths
  • Premium component integration

Applications

  • Complex computing tasks
  • Data-intensive operations
  • Performance-critical systems

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