Intel Xeon Gold 5317 Dodeca-core (12 Core) 3GHz Server Processor, 24 Threads, 18MB L3 Cache, Socket LGA-4189, 10nm, 3rd Gen - CD8068904657302 (1 Year Warranty)

Intel Xeon Gold 5317 Dodeca-core (12 Core) 3GHz Server Processor, 24 Threads, 18MB L3 Cache, Socket LGA-4189, 10nm, 3rd Gen - CD8068904657302 (1 Year Warranty)
Intel Xeon Gold 5317 Dodeca-core (12 Core) 3GHz Server Processor, 24 Threads, 18MB L3 Cache, Socket LGA-4189, 10nm, 3rd Gen - CD8068904657302 (1 Year Warranty)
Intel Xeon Gold 5317 Dodeca-core (12 Core) 3GHz Server Pr...

Intel Xeon Gold 5317 Dodeca-core (12 Core) 3GHz Server Processor, 24 Threads, 18MB L3 Cache, Socket LGA-4189, 10nm, 3rd Gen - CD8068904657302 (1 Year Warranty)

Intel CD8068904657302

41,946.00 ฿
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Clock Speed:

  • 1.50 GHz
  • 3.70 GHz
  • 3.40 GHz
  • 2.80 GHz
  • 2.30 GHz
  • 3 GHz
  • 2.10 GHz
  • 2.40 GHz
  • 4 GHz
  • 1.90 GHz
  • 3.20 GHz
  • 2.50 GHz

Processor Core:

  • 2 Core
  • 8 Core
  • 10 Core
  • 12 Core
  • 24 Core
  • 16 Core
  • 6 Core

Product Key Features

  • 🚀 12-Core Intel Xeon Gold 5317 with 3.0 GHz base clock
  • ⚡ Turbo boost up to 3.60 GHz
  • 💾 18 MB L3 Cache for enhanced performance
  • 🧵 24 processing threads for heavy workloads
  • 🔌 Socket LGA-4189 compatibility
  • 🔬 10 nm process technology
  • 🌡️ 150W Thermal Design Power
  • 💪 Supports up to 4-socket configurations
  • 🆕 3rd Generation architecture
  • 🌐 Optimized for data center and multi-cloud computing
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Intel

CD8068904657302

Intel Xeon Gold 5317 12-Core Server Processor - 3GHz, Socket LGA-4189, 3rd Gen

Experience exceptional server performance with the Intel Xeon Gold 5317, a powerful 12-core processor designed for demanding data center and multi-cloud computing environments. This 3rd generation processor, built on advanced 10nm technology, delivers base speeds of 3.0 GHz with turbo boost capability up to 3.60 GHz, making it ideal for intensive enterprise workloads.

Advanced Processing Architecture

  • Dodeca-core (12 Core) architecture with 24 threads for superior multitasking
  • 18 MB L3 Cache for enhanced data access and processing
  • Socket LGA-4189 compatibility for enterprise-grade systems
  • 10nm process technology for improved efficiency
  • 64-bit processing capability for advanced computing needs

Performance and Thermal Specifications

The Xeon Gold 5317 operates at a base clock speed of 3.0 GHz and can reach up to 3.60 GHz with overclocking capabilities. With a Thermal Design Power (TDP) of 150W and maximum thermal specification of 84°C (183.2°F), this processor delivers reliable performance while maintaining optimal thermal efficiency.

Enterprise-Grade Features

Designed for professional server environments, this OEM processor supports enhanced memory capacity and four-socket scalability. The Intel Xeon Gold 5317 is optimized for mainstream data center operations, multi-cloud compute environments, and demanding network and storage workloads.

Technical Specifications

Specification Detail
Processor Model Xeon Gold 5317
Core Configuration 12 Cores / 24 Threads
Base/Turbo Frequency 3.0 GHz / 3.60 GHz
Cache Size 18 MB L3
Socket Type LGA-4189
Manufacturing Process 10 nm
TDP 150W

Intel® Xeon® Gold Processors

With support for the higher memory speeds, enhanced memory capacity, and four-socket scalability, Intel® Xeon® Gold processors deliver significant improvement in performance, advanced reliability, and hardware-enhanced security. It is optimized for demanding mainstream data center, multi-cloud compute, and network and storage workloads. With up-to four-socket scalability, it is suitable for an expanded range of workloads.

Return Policy

Time to Return

Standard Return Policy

We offer a hassle-free 30-day returns policy for domestic (US) orders, excluding non-refundable items. Refund or Replacement within 30 days of the delivery date. All products that fall under the Standard Return Policy qualify for our 30-Day Hassle-Free Returns. Please see the section above for more details.

Replacement Only Return Policy

Replacement within 30 days of the delivery date.

Manufacturer Only Return Policy

Covered by the manufacturer's warranty. Please refer to the terms and conditions for the manufacturer's warranty or contact the manufacturer.

Holiday Extended Return Policies

Extended Holiday Return Policy.

Qualifying purchases of products displaying the " Extended Holiday Return Policy ", from November 1st, 2023 to December 25, 2023, are eligible for a Refund or Replacement until January 31, 2024.

Extended Holiday Replacement-Only Return Policy

Qualifying purchases of products displaying the " Extended Holiday Replacement-Only Return Policy ", from November 1st, 2023 to December 25, 2023, are eligible for a Replacement until January 31, 2024.

FAQ
The Intel Xeon Gold 5317 is a high-performance 3rd Gen processor featuring 12 cores (24 threads) with a base clock speed of 3.0 GHz and can reach up to 3.60 GHz when overclocked. It's built on a 10 nm process technology and includes 18 MB of L3 cache. The processor uses the Socket LGA-4189 interface and supports 64-bit processing.
The Intel Xeon Gold 5317 has a Thermal Design Power (TDP) of 150W and can operate at temperatures up to 84°C (183.2°F). This thermal specification ensures reliable performance in demanding server environments while maintaining efficient power consumption.
The Intel Xeon Gold 5317 is optimized for demanding mainstream data center operations, multi-cloud compute environments, and network and storage workloads. It offers enhanced reliability and hardware-enhanced security features, making it ideal for enterprise-level applications that require robust performance and scalability.
The Intel Xeon Gold 5317 supports up to four-socket scalability, allowing for significant system expansion. This scalability feature makes it suitable for an expanded range of workloads and enables businesses to build powerful multi-processor systems for demanding enterprise applications.
The Intel Xeon Gold 5317 supports higher memory speeds and enhanced memory capacity compared to previous generations. As part of the Xeon Gold series, it's designed to handle intensive memory operations, making it ideal for memory-demanding applications in data center environments.
The Intel Xeon Gold 5317 processor has physical dimensions of 3.1 inches in width and 2.2 inches in depth. These dimensions are compatible with the LGA-4189 socket form factor, ensuring proper fit in server motherboards designed for this platform.
The 10nm process technology used in the Xeon Gold 5317 enables improved power efficiency and better performance per watt. This advanced manufacturing process allows for higher transistor density, resulting in better overall performance while maintaining the 150W TDP envelope.
The Intel Xeon Gold 5317 features 12 physical cores with 24 threads through Intel's Hyper-Threading Technology. This multi-threading capability enables efficient parallel processing and improved performance for multi-threaded applications and server workloads.

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