Lenovo 4X77A08632 16GB TruDDR4 Memory Module, Dual-rank, 3200 MHz, ECC, Registered, Server RAM
Lenovo 4X77A08632 16GB TruDDR4 Memory Module, Dual-rank, 3200 MHz, ECC, Registered, Server RAM
Lenovo 4X77A08632
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- Free Shipping
- 1 Year Warranty
- 30 Day Returns
- Carbon Neutral
Product Key Features
- Compatibility with a wide range of Lenovo products, including ThinkAgile and ThinkSystem series
- 16GB TruDDR4 Memory Module for enhanced performance
- Dual-rank memory for efficient data processing
- 3200 MHz memory speed for fast and smooth multitasking
- ECC error checking for reliable data integrity
- 1.20V memory voltage for optimal power efficiency
- 288-pin DIMM form factor for easy installation
- Registered signal processing for improved stability
- DDR4-3200/PC4-25600 memory standard for high-speed data transfer
- Suitable for server applications
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Lenovo
4X77A08632
In addition, TruDDR4 Memory DIMMs have a unique signature programmed into them so your system can verify that TruDDR4 Memory is installed in your system. Since the memory will be authenticated, memory stretch goals are enabled only when TruDDR4 Memory DIMMs are detected. Together with lower power consumption, these new DIMMs can provide the lowest TCO for data centers.
High Performance Memory
Lenovo offers high-performance and high-capacity memory options in ThinkSystem servers.
Persistent Memory Lenovo
ThinkSystem servers configured with Intel Optane Persistent Memory transforms the memory/storage hierarchy enabling faster insights from data. This breakthrough technology delivers large capacity, high speed, affordable memory with data persistence and advanced encryption capabilities. These DDR4 compatible modules significantly increase the capacity of available system memory, keeping more hot data closer to the CPU, and enabling greater operational efficiency by processing larger data sets with more user instances.
3DS RDIMMs
To meet the ever increasing demand for higher density server memory modules, Lenovo offers 3DS (3 Dimensional Stacked) DDR4 RDIMMs which apply TSV (Through Silicon Via) technology from our partnership with a leading Tier 1 DRAM supplier. The new TSV 3DS stack technology enables higher density DRAM stack packages with higher operational frequency and reduced power consumption. The RDIMM configuration along with 3DS TSV DRAM packages exhibits performance benefits and lower power consumption over alternative high density solutions to ultimately provide the lowest TCO for data centers.
Performance+ Memory
Memory intensive workloads needing a competitive advantage will benefit from Lenovo's Performance+memory. Lenovo engineers worked in partnership with leading memory suppliers to develop and tune ThinkSystem servers enabling them to exceed the latest industry standard for memory performance.Lenovo's Performance+ memory delivers increased bandwidth and lower latency at 2933 MHz withmemory all channels fully populated.
Return Policy |
Time to Return |
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Standard Return Policy |
We offer a hassle-free 30-day returns policy for domestic (US) orders, excluding non-refundable items. Refund or Replacement within 30 days of the delivery date. All products that fall under the Standard Return Policy qualify for our 30-Day Hassle-Free Returns. Please see the section above for more details. |
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Replacement Only Return Policy |
Replacement within 30 days of the delivery date. |
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Manufacturer Only Return Policy |
Covered by the manufacturer's warranty. Please refer to the terms and conditions for the manufacturer's warranty or contact the manufacturer. |
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Holiday Extended Return Policies |
Extended Holiday Return Policy.Qualifying purchases of products displaying the " Extended Holiday Return Policy ", from November 1st, 2023 to December 25, 2023, are eligible for a Refund or Replacement until January 31, 2024. Extended Holiday Replacement-Only Return PolicyQualifying purchases of products displaying the " Extended Holiday Replacement-Only Return Policy ", from November 1st, 2023 to December 25, 2023, are eligible for a Replacement until January 31, 2024. |
